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Solder Wire
Solder Wire Form Flux-Cored Wire Material Composition 99.3 Percent Tin 0.7 Percent Copper Wire Diameter 0.5 mm Weight 500 g Melting Temperature (Maximum) 442 Degrees F Flux Type No-Clean Flux Classification ROL0 Solder Series SC L0 For Joining Metal Container Type Spool Features 100 Percent Halogen Free Wire Good Wetting Characteristics Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70 Percent Reduced Splash of Flux and No-Clean Flux
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Solder Wire Form Flux-Cored Wire Material Composition 99.3 Percent Tin 0.7 Percent Copper Wire Diameter 0.5 mm Weight 500 g Melting Temperature (Maximum) 442 Degrees F Flux Type No-Clean Flux Classification ROL0 Solder Series SC L0 For Joining Metal Container Type Spool Features 100 Percent Halogen Free Wire Good Wetting Characteristics Reduced Fe Leaching to Increase Tip Life Time and Reduce Tip Consumption by upto 70 Percent Reduced Splash of Flux and No-Clean Flux
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