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Solder Wire
Solder Wire Form Flux-Cored Wire Material Composition 96.5 Percent Tin 3 Percent Silver 0.5 Percent Copper Wire Diameter 0.3 mm Weight 500 g Melting Temperature (Minimum) 422 Degrees F Melting Temperature (Maximum) 430 Degrees F Flux Type No-Clean Flux Classification ROL0 Solder Series SAC L0 For Joining Metal Application High Soldering Temperature Container Type Spool
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Solder Wire Form Flux-Cored Wire Material Composition 96.5 Percent Tin 3 Percent Silver 0.5 Percent Copper Wire Diameter 0.3 mm Weight 500 g Melting Temperature (Minimum) 422 Degrees F Melting Temperature (Maximum) 430 Degrees F Flux Type No-Clean Flux Classification ROL0 Solder Series SAC L0 For Joining Metal Application High Soldering Temperature Container Type Spool