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Hot Melt Adhesive, Bonds To: Electronics, Lightweight Substrates, Polypropylene, Vinyl and Wood, 350 to 385 °F, 45 s Application Time, 65 s Curing, Black
● In Stock

Hot Melt Adhesive, Bonds To: Electronics, Lightweight Substrates, Polypropylene, Vinyl and Wood, 350 to 385 °F, 45 s Application Time, 65 s Curing, Black

3M™ hot melt adhesive 3748 provides good resistance to heat, impact, fuel and oil. It is manufactured using 100% solids, thermoplastic resin for use with a 3M™ hot melt applicator. This adhesive provides high temperature stability 175 °F/79 °C with a 25 sec open time that is sufficient for fit positioning and adjusting. 3M™ hot melt adhesive 3748 will bond wood, polypropylene, electronics, vinyl and lightweight substrates on furniture, automotive interiors, outdoor applications, small appliances and general product assembly. Hot melt adhesives, also known as glue sticks, are liquefied thermoplastic adhesives available in both low and high temperature versions. Low temperature hot melt adhesives are applied at 250 °F/121 °C temperatures, which makes them ideal for bonding electronics, plastics, cloth and other heat sensitive materials. High temperature hot melt adhesives are applied at 380 °F/193 °C and produce a stronger bond than the low temperature hot melts. Melted adhesive is extruded through a nozzle using a 3M™ hot melt applicator by either pneumatic pressure, a mechanical trigger mechanism or with pressure applied directly on the stick. Different nozzles can be used to apply thin, wide strips or narrow, thicker beads. Hot melt adhesive generally sets quickly, ranging from a few seconds to a few minutes, depending on the adhesive formulation. In our 3M™ industrial adhesives and tapes division, we apply the science of adhesion to deliver innovative solutions that improve the design and manufacturing processes of companies around the world. In the end, our technologies help customers like you deliver competitive products to the market faster and more efficiently. 3M™ 7010366174, Bonds To: Electronics, Lightweight Substrates, Polypropylene, Vinyl and Wood, 350 to 385 °F, 45 s Application Time, 65 s Curing, Black

Hubzone SKU 88487069588
Manufacturer 3M™
Manufacturer Part Number 7010366174
UNSPSC Code
31201609 ⓘ
NAICS Code
N/A ⓘ
Unit of Measure N/A
Availability ● In Stock
Lead Time Ships in 1–2 business days
Status ● Active

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Product Overview

3M™ hot melt adhesive 3748 provides good resistance to heat, impact, fuel and oil. It is manufactured using 100% solids, thermoplastic resin for use with a 3M™ hot melt applicator. This adhesive provides high temperature stability 175 °F/79 °C with a 25 sec open time that is sufficient for fit positioning and adjusting. 3M™ hot melt adhesive 3748 will bond wood, polypropylene, electronics, vinyl and lightweight substrates on furniture, automotive interiors, outdoor applications, small appliances and general product assembly. Hot melt adhesives, also known as glue sticks, are liquefied thermoplastic adhesives available in both low and high temperature versions. Low temperature hot melt adhesives are applied at 250 °F/121 °C temperatures, which makes them ideal for bonding electronics, plastics, cloth and other heat sensitive materials. High temperature hot melt adhesives are applied at 380 °F/193 °C and produce a stronger bond than the low temperature hot melts. Melted adhesive is extruded through a nozzle using a 3M™ hot melt applicator by either pneumatic pressure, a mechanical trigger mechanism or with pressure applied directly on the stick. Different nozzles can be used to apply thin, wide strips or narrow, thicker beads. Hot melt adhesive generally sets quickly, ranging from a few seconds to a few minutes, depending on the adhesive formulation. In our 3M™ industrial adhesives and tapes division, we apply the science of adhesion to deliver innovative solutions that improve the design and manufacturing processes of companies around the world. In the end, our technologies help customers like you deliver competitive products to the market faster and more efficiently. 3M™ 7010366174, Bonds To: Electronics, Lightweight Substrates, Polypropylene, Vinyl and Wood, 350 to 385 °F, 45 s Application Time, 65 s Curing, Black

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Procurement Details

UNSPSC Code 31201609
NAICS Code N/A

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